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CS5253B-8 3.0 A LDO 5-Pin 2.5 V Fixed Linear Regulator for Remote Sense Applications
This new very low dropout linear regulator reduces total power dissipation in the application. To achieve very low dropout, the internal pass transistor is powered separately from the control circuitry. Furthermore, with the control and power inputs tied together, this device can be used in single supply configuration and still offer a better dropout voltage than conventional PNP-NPN based LDO regulators. In this mode the dropout is determined by the minimum control voltage. The CS5253B-8 is offered in a five-terminal D2PAK-5 package, which allows for the implementation of a remote-sense pin permitting very accurate regulation of output voltage directly at the load, where it counts, rather than at the regulator. This remote sensing feature virtually eliminates output voltage variations due to load changes and resistive voltage drops. Typical load regulation measured at the sense pin is less than 1.0 mV for an output voltage of 2.5 V with a load step of 10 mA to 3.0 A. The CS5253B-8 has a very fast transient loop response. Internal protection circuitry provides for "bust-proof" operation, similar to three-terminal regulators. This circuitry, which includes overcurrent, short circuit, and overtemperature protection will self protect the regulator under all fault conditions. The CS5253B-8 is ideal for generating a 2.5 V supply to power graphics controllers used on VGA cards. Its remote sense and low value capacitance requirements make this a low cost high performance solution. The CS5253B-8 is optimized from the CS5253-1 to allow a lower value of output capacitor to be used at the expense of a slower transient response.
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1 5 D2PAK-5 DP SUFFIX CASE 936AC
Tab = VOUT Pin 1. VSENSE 2. GND 3. VOUT 4. VCONTROL 5. VPOWER
MARKING DIAGRAM
CS 5253B-8 AWLYWWG 1
* * * * * * * * * * * * *
VOUT Fixed @ 2.5 V 1.5% VPOWER Dropout < 0.40 V @ 3.0 A VCONTROL Dropout < 1.05 V @ 3.0 A 1.5% Trimmed Reference Fast Transient Response Remote Voltage Sensing Thermal Shutdown Current Limit Short Circuit Protection Drop-In Replacement for EZ1582 Backwards Compatible with 3-Pin Regulators Very Low Dropout Reduces Total Power Consumption Pb-Free Packages are Available*
CS5253B-8 A WL Y WW G
= Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package
ORDERING INFORMATION
Device CS5253B-8GDP5 CS5253B-8GDP5G CS5253B-8GDPR5 CS5253B-8GDPR5G Package D2PAK-5 D2PAK-5 (Pb-Free) D2PAK-5 750/Tape & Reel Shipping 50 Units/Rail 50 Units/Rail
D2PAK-5 750/Tape & Reel (Pb-Free)
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2005
1
October, 2005- Rev. 6
Publication Order Number: CS5253B-8/D
CS5253B-8
RDIS +5.0 V VCONTROL VOUT VSENSE CS5253B-8 +3.3 V 10 mF 10 V VPOWER GND 33 mF 5.0 V CLOAD (Optional) 2.5 V @ 3.0 A
100 mF 5.0 V
GND RDIS
GND
Figure 1. Application Diagram
MAXIMUM RATINGS
Rating VPOWER Input Voltage VCONTROL Input Voltage Operating Junction Temperature Range, TJ Storage Temperature Range ESD Damage Threshold Lead Temperature Soldering: Reflow: (SMD styles only) (Note 1) Value 6.0 13 0 to 150 -65 to +150 2.0 230 Peak Unit V V C C kV C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. 60 second maximum above 183C.
ELECTRICAL CHARACTERISTICS (0C TA 70C; 0C TJ 150C; VSENSE = VOUT and GND = 0 V; unless otherwise specified.)
Characteristic Output Voltage Line Regulation Load Regulation Minimum Load Current (Note 2) Control Pin Current (Note 3) Ground Pin Current Current Limit Short Circuit Current Ripple Rejection (Note 4) Thermal Regulation Test Conditions VCONTROL = 3.9 V to 12 V, VPOWER = 3.13 V to 5.5 V, IOUT = 10 mA to 3.0 A VCONTROL = 3.9 V to 12 V, VPOWER = 3.13 V to 5.5 V, IOUT = 10 mA VCONTROL = 3.9 V, VPOWER = 3.13 V, IOUT = 10 mA to 3.0 A, with Remote Sense VCONTROL = 5.0 V, VPOWER = 3.3 V, DVOUT = +1.0% VCONTROL = 3.9 V, VCONTROL = 3.9 V, VPOWER = 3.13 V, IOUT = 100 mA VPOWER = 3.13 V, IOUT = 3.0 A Min 2.463 (-1.5%) - - - - - - 3.1 2.0 60 - Typ 2.5 0.02 0.04 0 6.0 35 7 4.0 3.5 80 0.002 Max 2.538 (+1.5%) 0.2 0.3 0 10 120 10 - - - - Unit V % % mA mA mA mA A A dB %/W
VCONTROL = 3.9 V, VPOWER = 3.13 V, IOUT = 10 mA VCONTROL = 3.9 V, VPOWER = 3.13 V, DVOUT = -4.0% VCONTROL = 3.9 V, VPOWER = 3.13 V, VOUT = 0 V VCONTROL = VPOWER = 3.9 V, VRIPPLE = 1.0 VP-P @ 120 Hz, IOUT = 3.0 A 30 ms Pulse, TA = 25C
2. The minimum load current is the minimum current required to maintain regulation. 3. The VCONTROL pin current is the drive current required for the output transistor. This current will track output current with roughly a 1:100 ratio. The minimum value is equal to the quiescent current of the device. 4. This parameter is guaranteed by design and is not 100% production tested.
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CS5253B-8
ELECTRICAL CHARACTERISTICS (continued) (0C TA 70C; 0C TJ 150C; VSENSE = VOUT and GND = 0 V; unless
otherwise specified.) Characteristic VCONTROL Dropout Voltage (Minimum VCONTROL - VOUT) (Note 5) VPOWER Dropout Voltage (Minimum VPOWER - VOUT) (Note 5) RMS Output Noise Temperature Stability Thermal Shutdown (Note 6) Thermal Shutdown Hysteresis VCONTROL Supply Only Output Current VPOWER Supply Only Output Current Test Conditions VPOWER = 3.13 V, IOUT = 100 mA VPOWER = 3.13 V, IOUT = 1.0 A VPOWER = 3.13 V, IOUT = 3.0 A VCONTROL = 3.9 V, IOUT = 100 mA VCONTROL = 3.9 V, IOUT = 1.0 A VCONTROL = 3.9 V, IOUT = 3.0 A Freq = 10 Hz to 10 kHz, TA = 25C - - - VCONTROL = 13 V, VPOWER Not Connected, GND = VOUT = VSENSE = 0 V VPOWER = 6.0 V, VCONTROL Not Connected, GND = VOUT = VSENSE = 0 V Min - - - - - - - 0.5 150 - - - Typ 0.90 1.00 1.05 0.05 0.15 0.40 0.003 - 180 25 - 0.1 Max 1.15 1.15 1.30 0.15 0.25 0.60 - - 210 - 50 1.0 Unit V V V V V V %VOUT % C C mA mA
5. Dropout is defined as either the minimum control voltage (VCONTROL) or minimum power voltage (VPOWER) to output voltage differential required to maintain 1.5% regulation at a particular load current. 6. This parameter is guaranteed by design, but not parametrically tested in production. However, a 100% thermal shutdown functional test is performed on each part.
PACKAGE PIN DESCRIPTION
Package Pin # 1 2 3 4 Pin Symbol VSENSE GND VOUT VCONTROL Function This Kelvin sense pin allows for remote sensing of the output voltage at the load for improved regulation. It is internally connected to the positive input of the voltage sensing error amplifier. This pin is connected to system ground. This pin is connected to the emitter of the power pass transistor and provides a regulated voltage capable of sourcing 3.0 A of current. This is the supply voltage for the regulator control circuitry. For the device to regulate, this voltage should be between 0.9 V and 1.3 V (depending on the output current) greater than the output voltage. The control pin current will be about 1.0% of the output current. This is the power input voltage. This pin is physically connected to the collector of the power pass transistor. For the device to regulate, this voltage should be between 0.1 V and 0.6 V greater than the output voltage depending on the output current. The output load current of 3.0 A is supplied through this pin.
5
VPOWER
VPOWER VCONTROL
BIAS and TSD
VREF
- +
EA
IA
+ - VOUT VSENSE
Figure 2. Block Diagram
GND
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CS5253B-8
TYPICAL PERFORMANCE CHARACTERISTICS
2.501 2.500 Reference Voltage (V) Output Current (A) 2.499 2.498 2.497 2.496 2.495 2.494 0 20 40 60 80 100 120 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 1 2 3 4 5 6 Measured at DVOUT = -1.5%
Junction Temperature (C)
VPOWER - VOUT (V)
Figure 3. Output Voltage vs Junction Temperature
3.9 Short Circuit Output current Limit (A)
VOUT CS5253-1 COUT = 330 mF
Figure 4. Output Current vs VPOWER - VOUT
3.8 3.7 3.6 3.5 3.4 3.3
VCONTROL = 5.0 V VPOWER = 3.3 V
VCONTROL = 5.0 V VPOWER = 3.3 V VOUT = 2.5 V CCONTROL = 10 mF CADJ = 0.1 mF
VOUT CS5253B-8 COUT = 33 mF
15 A/ms
80 A/ms ILOAD 10 mA to 3.0 A
0
20
40
60
80
100
120
140
Junction Temperature (C)
Figure 5. Transient Response Comparison between CS5253-1 and CS5253B-8
0.12 0.10 Load Regulation (%) TJ = 120C 0.08 0.06 TJ = 20C 0.04 TJ = 0C 0.02 0
Figure 6. Short Circuit Output Current vs Junction Temperature
12 10 8 IOUT (mA) 6 4 2 0 VCONTROL = 13 V VOUT = 0 V VPOWER Not Connected
0
0.5
1.0
1.5
2.0
2.5
3.0
0
20
40
60
80
100
120
140
Output Current (A)
Junction Temperature (C)
Figure 7. Load Regulation vs Output Current
Figure 8. VCONTROL Only Output Current vs Junction Temperature
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CS5253B-8
500 450 VPOWER Dropout Voltage (V) 400 350 300 250 200 150 100 50 0 0 0 0.5 1.0 1.5 2.0 2.5 3.0 Output Current (A) 0 20 40 60 80 100 120 140 TJ = 20C TJ = 0C TJ = 120C 20 IOUT (mA) 15 10 5 25 30 VPOWER = 6.0 V VOUT = 0 V VCONTROL Not Connected
Junction Temperature (C)
Figure 9. VPOWER Dropout Voltage vs Output Current
Figure 10. VPOWER Only Output Current vs Junction Temperature
5.0 VPOWER = 3.3 V VCONTROL = 5.0 V VOUT = 2.5 V TA = 25C 4.5
90 80 Ripple Rejection (dB) 70 60 50 40 30 20 10 101 VIN - VOUT = 2.0 V IOUT = 3.0 A VRIPPLE = 1.0 VP-P COUT = 22 mF CADJ = 0.1 mF 102 103 104 105 106 Current Limit (A)
4.0
3.5
0
0.5
1.0
1.5 VOUT (V)
2.0
2.5
3.0
Frequency (Hz)
Figure 11. Ripple Rejection vs Frequency
1100 VCONTROL Dropout Voltage (mV) VPOWER = 2.05 V TJ = 0C 1000 ICONTROL (mA) 40 35 30 25 20 15 10 5 800 0 0.5 1.0 1.5 2.0 2.5 3.0 0 0
Figure 12. Current Limit vs VOUT
VCONTROL = 3.9 V VPOWER = 3.13 V IOUT = 3.0 A
TJ = 20C 900 TJ = 120C
IOUT = 1.0 A IOUT = 100 mA 20 40 60 80 100 120 140
Output Current (A)
Junction Temperature (C)
Figure 13. VCONTROL Dropout Voltage vs Output Current
Figure 14. VCONTROL Supply Current vs Junction Temperature
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CS5253B-8
6 5 4 ESR (W) Unstable 3 2 Stable Region 1 0 VPOWER = 3.3 V VCONTROL = 5.0 V ILOAD = 0 to 3.0 A VOUT = 2.5 V VOUT Shorted to VSENSE TJ = 0C to 150C
0
10
20
30
40
50
60
70
80
90
100
Capacitance (mF)
Figure 15. Stability vs ESR
APPLICATIONS NOTES
THEORY OF OPERATION DESIGN GUIDELINES Remote Sense
The CS5253B-8 linear regulator is fixed at 2.5 V at currents up to 3.0 A. The regulator is protected against short circuits, and includes a thermal shutdown circuit with hysteresis. The output, which is current limited, consists of a PNP-NPN transistor pair and requires an output capacitor for stability.
VPOWER Function
The CS5253B-8 utilizes a two supply approach to maximize efficiency. The collector of the power device is brought out to the VPOWER pin to minimize internal power dissipation under high current loads. VCONTROL provides for the control circuitry and the drive for the output NPN transistor. VCONTROL should be at least 1.0 V greater than the output voltage. Special care has been taken to ensure that there are no supply sequencing problems. The output voltage will not turn on until both supplies are operating. If the control voltage comes up first, the output current will be limited to about three milliamperes until the power input voltage comes up. If the power input voltage comes up first, the output will not turn on at all until the control voltage comes up. The output can never come up unregulated. The CS5253B-8 can also be used as a single supply device with the control and power inputs tied together. In this mode, the dropout will be determined by the minimum control voltage.
Output Voltage Sensing
Remote sense operation can be easily obtained with the CS5253B-8 but some care must be paid to the layout and positioning of the filter capacitors around the part. The ground side of the input capacitors on the +5.0 V and +3.3 V lines and the local VOUT-to-ground output capacitor on the IC must be tied close to the ground pin of the regulator. This will establish the stability of the part. The IC ground may then be connected to ground remotely at the load, giving the ground portion remote sense operation. The VSENSE line can then be tied remotely at the positive load connection, giving the feedback remote sense operation. The remote sense lines should be Kelvin connected so as to eliminate the effect of load current voltage drop. An optional bypass capacitor may be used at the load to reduce the effect of load variations and spikes.
Current Limit
The internal current limit circuit limits the output current under excessive load conditions.
Short Circuit Protection
The device includes short circuit protection circuitry that clamps the output current at approximately 500mA less than its current limit value. This provides for a current foldback function, which reduces power dissipation under a direct shorted load.
Thermal Shutdown
The CS5253B-8 five terminal linear regulator includes a dedicated VSENSE function. This allows for true Kelvin sensing of the output voltage. This feature can virtually eliminate errors in the output voltage due to load regulation. Regulation will be optimized at the point where the sense pin is tied to the output.
The thermal shutdown circuitry is guaranteed by design to activate above a die junction temperature of approximately 150C and to shut down the regulator output. This circuitry has 25C of typical hysteresis, thereby allowing the regulator to recover from a thermal fault automatically.
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CS5253B-8
RDIS +5.0 V +3.3 V
+ +
VCONTROL VPOWER
VOUT VSENSE GND
+
+Load
CS5253B-8 10 mF 100 mF Local Connections 33 mF Remote Connections
+
Optional
GND RDIS
-Load
Figure 16. Remote Sense
Calculating Power Dissipation and Heatsink Requirements
High power regulators such as the CS5253B-8 usually operate at high junction temperatures. Therefore, it is important to calculate the power dissipation and junction temperatures accurately to ensure that an adequate heatsink is used. Since the package tab is connected to VOUT on the CS5253B-8, electrical isolation may be required for some applications. Also, as with all high power packages, thermal compound in necessary to ensure proper heat flow. For added safety, this high current LDO includes an internal thermal shutdown circuit The thermal characteristics of an IC depend on the following four factors: junction temperature, ambient temperature, die power dissipation, and the thermal resistance from the die junction to ambient air. The maximum junction temperature can be determined by:
TJ(max) + TA(max) ) PD(max) RqJA
A heatsink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment has a thermal resistance which is measured in degrees per watt. Like series electrical resistances, these thermal resistances are summed to determine the total thermal resistance between the die junction and the surrounding air, RqJA. This total thermal resistance is comprised of three components. These resistive terms are measured from junction-to-case (RqJC), case-to-heatsink (RqCS), and heatsink-to-ambient air (RqSA). The equation is:
RqJA + RqJC ) RqCS ) RqSA
The maximum ambient temperature and the power dissipation are determined by the design while the maximum junction temperature and the thermal resistance depend on the manufacturer and the package type. The maximum power dissipation for a regulator is:
PD(max) + (VIN(max) * VOUT(min))IOUT(max) ) VIN(max) IIN(max)
The value for RqJC is 2.5C/watt for the CS5253B-8 in the D2PAK-5 package. For a high current regulator such as the CS5253B-8 the majority of heat is generated in the power transistor section. The value for RqSA depends on the heatsink type, while the RqCS depends on factors such as package type, heatsink interface (is an insulator and thermal grease used?), and the contact area between the heatsink and the package. Once these calculations are complete, the maximum permissible value of RqJA can be calculated and the proper heatsink selected. For further discussion on heatsink selection, see our application note "Thermal Management," document number AND8036/D.
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CS5253B-8
PACKAGE DIMENSIONS
D2PAK-5 DP SUFFIX CASE 936AC-01 ISSUE O
A E K S B H W M L P G D R -A- N
TERMINAL 6
U
V
NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. PACKAGE OUTLINE EXCLUSIVE OF MOLD FLASH AND METAL BURR. 4. PACKAGE OUTLINE INCLUSIVE OF PLATING THICKNESS. 5. FOOT LENGTH MEASURED AT INTERCEPT POINT BETWEEN DATUM A AND LEAD SURFACE. INCHES MIN MAX 0.396 0.406 0.330 0.340 0.170 0.180 0.026 0.036 0.045 0.055 0.067 REF 0.580 0.620 0.055 0.066 0.000 0.010 0.098 0.108 0.017 0.023 0.090 0.110 0_ 8_ 0.095 0.105 0.30 REF 0.305 REF 0.010 MILLIMETERS MIN MAX 10.05 10.31 8.38 8.64 4.31 4.57 0.66 0.91 1.14 1.40 1.70 REF 14.73 15.75 1.40 1.68 0.00 0.25 2.49 2.74 0.43 0.58 2.29 2.79 0_ 8_ 2.41 2.67 7.62 REF 7.75 REF 0.25
C
DIM A B C D E G H K L M N P R S U V W
PACKAGE THERMAL DATA Parameter RqJC RqJA Typical Typical D2PAK-5 2.5 10-50* Unit C/W C/W
*Depending on thermal properties of substrate. RqJA = RqJC + RqCA.
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CS5253B-8/D

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